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SEMICON Taiwan 2025 Concludes Successfully! Baoshili Ultra-Clean Series Products Lead the Wave of Innovation

2025-09-12


On September 12th, the three-day SEMICON Taiwan 2025 successfully concluded at the Taipei Nangang Exhibition Center. As one of the most influential semiconductor industry events in Asia, this year’s exhibition gathered numerous well-known enterprises from the global chip industry chain, focusing on showcasing the latest technologies and solutions in the fields of semiconductor manufacturing and advanced materials. Baoshili made a grand appearance with its ultra-pure fluorine materials and ultra-pure chemical packaging materials, fully demonstrating the company’s technological breakthroughs and industrialization capabilities in the field of high-end specialty materials.

01 Focus on Chemical Transfer Solutions

The exhibition site was crowded with visitors. Relying on its innovative products and in-depth solutions tailored to semiconductor chemical delivery scenarios, Baoshili attracted a large number of industry professionals and equipment manufacturers to stop and communicate. On-site technical discussions and demand matching were conducted around two key aspects: the application solutions of ultra-pure fluorine materials in chemical transfer for front-end processes of advanced manufacturing (such as cleaning, etching, deposition, etc.), and the current domestic supply bottlenecks in high-purity PFA products.


02 Breaking Through Cutting-Edge Process Challenges

As semiconductor manufacturing processes continue to evolve toward smaller process nodes, the requirement for chemical purity has been upgraded from ppb level to ppt level, making the cleanliness standards for chemical transfer and packaging materials particularly stringent. Such materials must possess excellent chemical corrosion resistance and extremely low ion leaching levels—any trace of impurities may directly affect device yield.

Facing this industry pain point, Baoshili specializes in semiconductor-grade chemical transfer and packaging solutions. Through continuous investment in technological R&D, the company has successfully developed products that meet the electronic-grade chemical transfer needs in advanced manufacturing processes: ultra-pure fluorine material products such as Ultra-Clean PFA Tube and Ultra-Clean PFA Connector for chemical transfer; and G5-grade 200L Ultra-Clean HDPE Drum packaging products for chemical packaging.


Currently, the relevant products have achieved localization replacement, providing the chip manufacturing industry with reliable local supply chain support.


03 Joining Forces for the Future and Co-Creating a New Vision

Looking ahead, Baoshili will continue to increase R&D investment, deepen its focus on the field of semiconductor ultra-clean material products, help advance the localization of key materials, and provide safer, more stable, and higher-purity products and solutions for the global semiconductor industry.




 
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